Apex Releases New Dual Channel, Multi-purpose Power Amplifier IC

Apex Microtechnology releases latest dual channel power amplifier IC, delivering high power density in a compact surface-mount package. 

Product Overview

The PA166 is the latest addition to Apex Microtechnology’s family of high density, multi-purpose power amplifier ICs utilizing leading-edge package design. Designed with power density in mind, the PA166 comes equipped with a pair of high voltage operational amplifiers with monolithic cores. In a surface mount package and with a body of just 20mm x 20mm, each channel is designed for operation up to 205V while providing 1A of continuous current. PA166 features exceptional channel separation of 80dB, while optional separate supplies for the amplifier core and output stage allow for optimized voltage swing with an overall power dissipation of 40W. The PA166 comes equipped with several safety features for system protection, including temperature compensated current limit, an over-current flag, and an output disable function.

PA166 Key Specifications

Apex Microtechnology's PA166

  • 2 individual op-amp channels
  • Configurable as independent, bridge or parallel
  • High continuous current - 1A
  • High PEAK output current - 4A
  • High supply voltage operation - 205V
  • Internal power dissipation - 40W
  • Temp compensated current limit with over-current flag
  • Monolithic MOS technology for amplifier core


Pushing Boundaries

“Apex’s latest power operational amplifier, PA166, boasts two fully independent amplifier channels in the space efficient PQ package,” says Director of Business Development, Jens Eltze, “This enables Apex to support applications where multiple individual, bridged, or paralleled amplifier channels in a small form factor is critical, while also maintaining the power handling capabilities of each channel in the package.”

PQ Package Features

Typical Applications

With the surface mount package style and exceptionally compact size, designers are afforded the ability to maximize board real estate, allowing for the use of multiple devices in circuit designs where high-power density is a critical requirement. A wide range of target applications include high density voltage or current sources, electrostatic transducers, electrostatic/electromagnetic deflection, deformable mirror focusing, and piezo electric positioning.

Bridge Configuration

Bridge Configuration

Parallel Configuration

Pricing, Availability, and Evaluation Tools

The PA166 is currently in volume production with sample units available for qualified applications. For additional details on availability, device lead-times, and pricing please contact the authorized Apex Microtechnology local sales representative or distribution partner for your region. To support rapid prototyping and device evaluation Apex offers the EK87 evaluation kit for PA166. Complete product information is available online on PA166's product page. For technical support, contact Apex Applications Engineering by calling 800-546-2739, or by emailing apex.support@apexanalog.com.

- The Apex Microtechnology Team 

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