Military Grade Power Management

Apex Microtechnology offers industry-leading analog devices that maximize performance while minimizing design space crucial for aerospace & defense applications.

In the rapidly evolving landscape of aerospace and defense (A&D) requirements, power management in analog devices has become more crucial than ever. Ensuring optimal performance in harsh conditions requires innovative solutions that balance high power density with effective thermal management. Apex Microtechnology offers industry-leading analog devices that maximize performance while minimizing design space. This article will explore how Apex’s integration of high-power components and reduction of package size contribute to enhanced efficiency, all while maintaining reliability. Furthermore, the article will discuss the importance of an efficient material stack-up design that optimizes thermal dissipation, ensuring Apex devices meet the rigorous demands of aerospace and defense applications.

Inherent Power Density

One of Apex’s core goals is to provide analog solutions that efficiently dissipate high power in compact packages, enabling easy integration into systems with limited board space. The need for servicing applications that have a ‘tight fit’ with regard to their internal components has influenced the Apex product portfolio to consist of compact power amplifier modules that can conveniently provide power that would normally be attributed to much larger discrete circuits. This ability to support high-power applications while minimizing board footprint exemplifies the associated power density that Apex can provide for A&D applications that are continually focusing on reducing weight and overall size to meet design requirements. The small package size of Apex products, coupled with their high output power specifications, makes them ideal for multichannel applications or other defense system applications that may require redundant modules. This redundancy can help to ensure greater longevity and reduced maintenance needs during critical missions.

Integration of High-power Components

Apex takes pride in being a leading manufacturer of high-power amplifier modules. As a result, product offerings from Apex mainly consist of high-power internal components. The output stages of many Apex products can support multiple amperes of continuous output current with peak currents of up to 100A. The circuit layout and device substrate are chosen such that they facilitate quick and direct heat spreading from the output power devices down through the package layers into whatever heatsink medium is applied. This level of efficiency in power dissipation is essential for systems that are designed with reliability and robustness in mind.

Reduced Package Size

One defining characteristic of Apex products is their overall compactness. During the design phase, circuit area is minimized to use as little space as possible while still adhering to established voltage breakdown, creepage and clearance specifications. Developing miniature packages that can efficiently dissipate power is no small feat. A significant amount of time and effort goes into the design of these packages, always with one goal in mind: power dissipation. Providing high-power solutions in relatively small packages is an imperative when it comes to servicing multiple industries that require compact solutions, such as aerospace and defense. Many of the applications that are being devised in the defense market are dependent upon the amount of available area to include necessary components for their mission. The continued focus on reducing the package size of Apex product offerings is complimentary to this market’s dependence, making its product portfolio an ideal choice for demanding applications.

Figure 1: Main Heat Flow Path for an Apex Microtechnology TO-3 Package

Efficient Stack up for Max Thermal Dissipation

The architecture of Apex products in regards to power management can be further elucidated by examining the stack up of the output power components. The output power components of any Apex product are chosen such that they provide a healthy margin when it comes to output voltage and current range. This ensures performance and robustness of the output stage when asked to deliver power to a load. These components are then solder attached to a substrate of Beryllium Oxide (BeO), which is known for its excellent thermal transfer characteristics. This BeO layer acts as a heat spreader, facilitating thermal matching across the entire circuit, and is then attached to a pin header assembly composed of cold rolled steel. The assembly ultimately connects to a heatsink through thermal interface material. This thermal interface material is commonly used when attaching two flat surfaces and is necessary for adequate mating of dissipative surfaces to influence and enhance thermal transfer. Many devices from the defense market can find themselves in situations with no realistic possibility for repair. In cases such as this, efficient power dissipation becomes a necessity because high reliability is a must.

Figure 2: Apex Microtechnology TO-3 Package Stack up

Recently, Apex Microtechnology released a new product line of radiation-tolerant operational amplifiers to serve applications with radiation requirements. Apex’s Rad-tolerant “R” devices are tested to maintain operability after exposure to certain levels of radiation. These devices include radiation data for HDR, ELDRS/LDR, and SEE testing, in addition to TID lot traceability and PIND data. Radiation tolerant devices are based on a Class H military grade that includes additional screening such as burn-in testing, which further speaks to device reliability. To learn more, visit our radiation tolerant device page.

- Apex Microtechnology